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        HN ELECTRONIC

        專業從事電磁式蜂鳴器、壓電式蜂鳴器生產及研發

        MLT-9650Y-05

        MLT-9650Y-05

        MLT-9650Y-05

        MLT-9650Y-05

        MLT-9650Y-05

        產品說明

        Specification for Electro-Magnetic Buzzer
             (SMD Type)

         

        Page 2 of 6

        Des.

        Chk.

        Model No.:

        MLT-9650Y-05

        Part No.

         

         

         

        3/19/2018

        3/19/2018

        1. Technical Parameter

        Measuring condition
               Part shall be measured under a condition (Temperature: 5~35℃, Humidity: 45%~85%R.H., Atmospheric pressure: 860 ~1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ~1060hPa) is regulated to measure.

        2

        Operating Voltage

        3-7Vo-p

        3

        Rated Voltage

        5 Vo-p

        4

        Sound Output at 10cm

        Min.85dB,at Rated Voltage at 10cm

        5

        Rated Current

        Max.30mA ,

        6

        Resonant Frequency

        2700±300Hz

        7

        Operating Temperature

        -20℃~+70℃

        8

        Store Temperature

        -30℃~+80℃

        9

        Net Weight

        Approx 1.5g

        10

        RoHS

        Yes

        1. Dimensions

        Unit: mm

         

        *Unit: mm; Tolerance: ±0.3mm Except Specified
             *Housing Material: Black LCP
             *Terminal plate: 2 soldering pads, tin Plating Brass

        1. Electrical And Acoustical Measuring Condition

        Recommended setting
             

        1. Frequency Response

         

        1. Surface mounting condition

        5.1 Reflow soldering
               Recommendable reflow soldering condition is as follows.
                
               Note: (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding
               and pulling forces or shocks against the SMD sound transducers shall be kept minimum
               to prevent them from electrical failures and mechanical damages of the devices.
               (2) In the reflow soldering, too high soldering temperatures and too large temperature
               Gradient such as rapid heating or cooling may cause electrical failures and mechanical
               damages of the devices.

        1. Reliability Test

        After any following tests the part shall meet specifications without any degradation in
               appearance and performance except SPL. SPL shall not deviate more than -10 dB
               from the initial value

          1. Ordinary Temperature Life Test

        The part shall be subjected to 96 hours at 25±10℃. Input rated voltage
               Resonant frequency, 1/2 duty Square wave.
               6.2 High Temperature Test
               The part shall be capable of with standing a storage temperature of +80℃ for 96 hours.
               6.3 Low Temperature Test 
               The part shall be capable of with standing a storage temperature of -30℃ for 96 hours.

          1. Humidity Test

        Temperature:+40℃±3℃   Relative Humidity:90%~95% Duration: 48 hours
               and expose to room temperature for 6 hours

          1. Temperature Shock Test

        Temperature:60℃ /1hour→ 25℃/3hours→-20℃/1hour→ 25℃/3hours (1cycle)
               Total cycle: 10 cycles

          1. Drop Test

        Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick,
               three sides, six plain.)

          1. Vibration Test

        Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes

          1. Reflow Test

        Use recommendable reflow soldering condition (as shown in 5.1)
               (1) No abnormality should be found after reflow
               (2) Good soldering to meet soldering requirements

         

        Note:
               As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.

        1. Packing

         

         

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